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Environmental testing - Part 2: Tests - Test CY: Damp heat, steady state, accelerated test primarily intended for components (IEC 60068-2-67:1995, IDT)
MS IEC 60068-2-67:2008 (CONFIRMED:2015)
Status : 1st Confirmation
Format : PDF

This Malaysian Standard provides a standard test procedure for the purpose of evaluating, in an accelerated manner, the resistance of small electrotechnical products, primarily non-hermetically sealed ....Read more components, to the deteriorative effect of damp heat. Close

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Environmental testing - Part 2-18: Tests - Test R and guidance: Water (IEC 60068-2-18:2000, IDT)
MS IEC 60068-2-18:2008 (CONFIRMED:2015)
Status : 1st Confirmation
Format : PDF

This Malaysian Standard specifies methods of test applicable to products which, during transportation, storage or in service, may be subjected to falling drops, impacting water or immersion.

RM 75.00

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Basic environmental testing procedures - Part 2: Tests - Test M: Low air pressure (IEC 60068-2-13:1983, IDT)
MS IEC 60068-2-13:2008 (CONFIRMED:2015)
Status : 1st Confirmation
Format : PDF

This Malaysian Standard deals with low pressure tests at room temperature.

RM 30.00

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BASIC ENVIRONMENTAL TESTING PROCEDURES - PART 2-50: TESTS - TESTS Z/AFC: COMBINED COLD/VIBRATION (SINUSOIDAL) TESTS FOR BOTH HEAT-DISSIPATING AND NON-HEAT-DISSIPATING SPECIMENS (IEC 60068-2-50:1983, IDT)
MS IEC 60068-2-50:2009
Status : Original
Format : PDF

This Malaysian Standard deals with combined cold/vibration (sinusoidal) tests applicable both toheat-dissipating and non-heat-dissipating specimens. It is basically a combination ofTest Fc: Vibration ....Read more (Sinusoidal) (IEC Publication 68-2-6) and Tests A: Cold (IEC Publication 68-2-1). Close

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BASIC ENVIRONMENTAL TESTING PROCEDURES - PART 2-55: TESTS - TEST EE AND GUIDANCE: BOUNCE (IEC 60068-2-55:1987, IDT)
MS IEC 60068-2-55:2009
Status : Original
Format : PDF

This Malaysian Standard determines the ability of a specimen to withstand specified severities of bounce.

RM 30.00

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ENVIRONMENTAL TESTING - PART 2-51: TESTS - TEST Z/BFC: COMBINED DRY HEAT/VIBRATION (SINUSOIDAL) TESTS FOR BOTH HEAT-DISSIPATING AND NON-HEAT-DISSIPATING SPECIMENS (IEC 60068-2-51:1983, IDT)
MS IEC 60068-2-51:2009
Status : Original
Format : PDF

This Malaysian Standard provides combined dry heat/vibration (sinusoidal) tests applicable both to heat-dissipating and non-heat-dissipating specimens.

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ENVIRONMENTAL TESTING - PART 2-57: TESTS - TEST FF: VIBRATION -TIME-HISTORY METHOD (IEC 60068-2-57:1999, IDT)
MS IEC 60068-2-57:2009
Status : Original
Format : PDF

This Malaysian Standard provides a standard procedure for determining, by the time-history method, the ability of a specimen to withstand specified severities of transient vibration.

RM 60.00

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ENVIRONMENTAL TESTING - PART 2-47: TESTS - MOUNTING OF SPECIMENS FOR VIBRATION, IMPACT AND SIMILAR DYNAMIC TESTS (IEC 60068-2-47:2005, IDT)
MS IEC 60068-2-47:2009
Status : Original
Format : PDF

This Malaysian Standard provides methods for mounting products, whether packaged or unpackaged, as well as mounting requirements for equipment and other articles, for the series of dynamic tests in MS ....Read more IEC 60068-2, that is impact (Test E), vibration (Test F) and acceleration, steady-state (Test G). Close

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BASIC ENVIRONMENTAL TESTING PROCEDURES - PART 2: TESTS - TEST N: CHANGE TEMPERATURE (IEC 60068-2-14:1984, AMD. 1:1986, IDT)
MS IEC 60068-2-14:2008
Status : Original
Format : PDF

This Malaysian Standard determines the ability of components, equipment and other articles to withstand rapid changes of ambient temperature. The exposure times to accomplish this depend upon the natu ....Read more re of the specimen. Close

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ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (IEC 60068-2-58: 2005, IDT)
MS IEC 60068-2-58:2008
Status : Original
Format : PDF

This Malaysian Standard outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. It provides the standard procedures for solder alloys containing lead ....Read more (Pb) and for lead-free solder alloys. It also provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys. Close

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