BASIC ENVIRONMENTAL TESTING PROCEDURES - PART 2: TESTS - TESTS B: DRY HEAT (IEC 60068-2-2:1974, AMENDMENT 1:1993, AMENDMENT 2:1994, IDT)
MS IEC 60068-2-2:2007Status : Withdrawal with replacement
Format : PDF
This Malaysian Standard specifies Test Ba: Dry heat for non-heat-dissipating specimen with sudden change of temperature; Test Bb: Dry heat for non-heat-dissipating specimen with gradual change of temp ....Read more
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"Please contact us if you are interested to purchase for reference."Environmental testing - Part 2-1: Tests - Test A: Cold (IEC 60068-2-1:2007, IDT)
MS IEC 60068-2-1:2008 (CONFIRMED:2015)Status : 1st Confirmation
Format : PDF
This Malaysian Standard specifies cold tests on both non-heat-dissipating and heat-dissipating specimens.
Basic environmental testing procedures - Part 2-10: Tests - Test J and guidance: Mould growth (IEC 60068-2-10:2005, IDT)
MS IEC 60068-2-10:2007 (CONFIRMED:2015)Status : 1st Confirmation
Format : PDF
This Malaysian Standard of IEC 60068 provides a test method for determining the extent to which electrotechnical products support mould growth and how any mould growth may affect the performance and o ....Read more
Environmental testing - Part 3-4: Supporting documentation and guidance - damp heat tests (IEC 60068-3-4:2001, IDT)
MS IEC 60068-3-4:2008 (CONFIRMED:2015)Status : 1st Confirmation
Format : PDF
This Malaysian Standard provides background information and recommendations for specifications on soldering and its test methods for solderability on all electrical and electronics components, equipme ....Read more
Environmental testing - Part 2: Tests - guidance on test T: Soldering (IEC 60068-2-44:1995, AMD. 1:1995, IDT)
MS IEC 60068-2-44:2008 (CONFIRMED:2015)Status : 1st Confirmation
Format : PDF
This Malaysian Standard provides background information and recommendations for specifications on soldering and its test methods for solderability on all electrical and electronics components, equipme ....Read more
Basic environmental testing procedures - Part 2: Tests - Test Z/AMD: Combined sequential cold, low air pressure, and damp heat test (IEC 60068-2-39:1976, IDT)
MS IEC 60068-2-39:2008 (CONFIRMED:2015)Status : 1st Confirmation
Format : PDF
This Malaysian Standard provides environmental test procedure consisting of the application of cold, low air pressure and damp heat; the first two conditions in combination and the second condition co ....Read more
Environmental testing - Part 2-27: Tests - Test EA and guidance: Shock (IEC 60068-2-27:2008, IDT)
MS IEC 60068-2-27:2008 (CONFIRMED:2015)Status : 1st Confirmation
Format : PDF
This Malaysian Standard applies to components, equipment and other electrotechnical products which, during transportation or in use, may be subjected to relatively infrequent non-repetitive shocks.
Environmental testing - Part 2: Test methods - Test CX: Damp heat, steady state (unsaturated pressurized vapour) (IEC 60068-2-66:1994, IDT)
MS IEC 60068-2-66:2008 (CONFIRMED:2025)Status : 2nd Confirmation
Format : PDF
This Malaysian Standard provides a standard test procedure for the purpose of evaluating, in an accelerated manner, the resistance of small electrotechnical products, primarily non-hermetically sealed ....Read more
BASIC ENVIRONMENTAL TESTING PROCEDURES - PART 2: TESTS - GUIDANCE FOR SOLAR RADIATION TESTING (IEC 60068-2-9:1975, IDT)
MS IEC 60068-2-9:2007Status : Original
Format : PDF
This Malaysian Standard specifies methods of simulation designed to examine the effect of solar radiation on equipment and components at the surface of the earth.
Environmental testing - Part 2-54: Tests - Test TA: Solderability testing of electronic components by the wetting balance method (IEC 60068-2-54:2006, IDT)
MS IEC 60068-2-54:2008 (CONFIRMED:2015)Status : 1st Confirmation
Format : PDF
This Malaysian Standards of IEC 60068 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable ....Read more