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MS IEC 60068-2-69:2008 (CONFIRMED:2015)
Environmental testing - Part 2-69: Tests - Test TE: Solderability testing, of electronic components for surface mounting devices (SMD) by the wetting balance method (IEC 60068-2-69:1995, IDT)
This Malaysian Standard outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices.
1st Confirmation
• (none) / (none) / (none)
PDF
06/05/2019
34
NSC 19 - Electrical & Electronics Equipments & Accessories
19.040
45.00