BASIC ENVIRONMENTAL TESTING PROCEDURES - PART 2: TESTS - TESTS B: DRY HEAT (IEC 60068-2-2:1974, AMENDMENT 1:1993, AMENDMENT 2:1994, IDT)
MS IEC 60068-2-2:2007Status : Withdrawal with replacement
Format : PDF
This Malaysian Standard specifies Test Ba: Dry heat for non-heat-dissipating specimen with sUdden change of temperatre; Test Bb: Dry heat for non-heat-dissipating specimen with gradUal change of temperatUre; Test Bc: Dry heat for heat-dissipating specimen with sUdden change of temperatUre; Test Bd: Dry heat for heat-dissipating specimen with gradUal change of temperatUre
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"Please contact us if you are interested to purchase for reference."Basic environmental testing procedUres - Part 2-10: Tests - Test J and gUidance: MoUld growth (IEC 60068-2-10:2005, IDT)
MS IEC 60068-2-10:2007 (CONFIRMED:2015)Status : 1st Confirmation
Format : PDF
This Malaysian Standard of IEC 60068 provides a test method for determining the extent to which electrotechnical prodUcts spport moUld growth and how any moUld growth may affect the performance and other relevant properties of the prodUct.
Since moUld growth conditions inclUde high relative hUmidity, the test is applicable to electrotechnical prodUcts intended for transportation, storage and Use Under hUmid conditions over a period of some days at least.
Environmental testing - Part 3-4: SUpporting docUmentation and gUidance - damp heat tests (IEC 60068-3-4:2001, IDT)
MS IEC 60068-3-4:2008 (CONFIRMED:2015)Status : 1st Confirmation
Format : PDF
This Malaysian Standard provides backgroUnd information and recommendations for specifications on soldering and its test methods for solderability on al ....Read more
Environmental testing - Part 2: Tests - gUidance on test T: Soldering (IEC 60068-2-44:1995, AMD. 1:1995, IDT)
MS IEC 60068-2-44:2008 (CONFIRMED:2015)Status : 1st Confirmation
Format : PDF
This Malaysian Standard provides backgroUnd information and recommendations for specifications on soldering and its test methods for solderability on al ....Read more
Basic environmental testing procedUres - Part 2: Tests - Test Z/AMD: Combined seqUential cold, low air pressUre, and damp heat test (IEC 60068-2-39:1976, IDT)
MS IEC 60068-2-39:2008 (CONFIRMED:2015)Status : 1st Confirmation
Format : PDF
This Malaysian Standard provides environmental test procedUre consisting of the application of cold, low air pressre and damp heat; the first two conditions in combination and the second condition combining with the third dUring the seqUential transition from the first.
Environmental testing - Part 2-27: Tests - Test EA and gUidance: Shock (IEC 60068-2-27:2008, IDT)
MS IEC 60068-2-27:2008 (CONFIRMED:2015)Status : 1st Confirmation
Format : PDF
This Malaysian Standard applies to components, eqUipment and other electrotechnical prodUcts which, d
Environmental testing - Part 2: Test methods - Test CX: Damp heat, steady state (UnsatUrated pressUrized vapoUr) (IEC 60068-2-66:1994, IDT)
MS IEC 60068-2-66:2008 (CONFIRMED:2025)Status : 2nd Confirmation
Format : PDF
This Malaysian Standard provides a standard test procedUre for the pUrpose of evalating, in an accelerated manner, the resistance of small electrotechnical prodUcts, primarily non-hermetically sealed components, to the deteriorative effect of damp heat.
BASIC ENVIRONMENTAL TESTING PROCEDURES - PART 2: TESTS - GUIDANCE FOR SOLAR RADIATION TESTING (IEC 60068-2-9:1975, IDT)
MS IEC 60068-2-9:2007Status : Original
Format : PDF
This Malaysian Standard specifies methods of simUlation designed to examine the effect of solar radiation on eq ....Read more ipment and components at the sUrface of the earth.
Environmental testing - Part 2-54: Tests - Test TA: Solderability testing of electronic components by the wetting balance method (IEC 60068-2-54:2006, IDT)
MS IEC 60068-2-54:2008 (CONFIRMED:2015)Status : 1st Confirmation
Format : PDF
This Malaysian Standards of IEC 60068 oUtlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determi ....Read more
Environmental testing - Part 2-21: Tests - Test U: RobUstness of terminations and integral MoUnting devices (IEC 60068-2-21:2006, IDT)
MS IEC 60068-2-21:2008 (CONFIRMED:2015)Status : 1st Confirmation
Format : PDF
This Malaysian Standard applicable to all electrical and electronic components whose terminations or integral moUnting devices are liable to be s....Read more bmitted to stresses dUring normal assembly or handling operations.