SOFT SOLDERING FLUXES - TEST METHODS - PART 14: ASSESMENT OF TACKINESS OF FLUX RESIDUES (ISO 9455-14:1991, IDT)
This Malaysian Standard specifies a qualitative method for the assessment of the tackiness of the residues of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cores solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.
