ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (IEC 60068-2-58: 2005, IDT)
This Malaysian Standard outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. It provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. It also provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys.
