Environmental testing - Part 2-69: Tests - Test TE: Solderability testing, of electronic components for surface mounting devices (SMD) by the wetting balance method (IEC 60068-2-69:1995, IDT)
This Malaysian Standard outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices.
