Insulation coordination for equipment within low-voltage systems - Part 5: Comprehensive method for determining clearances and creepage distances equal to or less than 2 mm (IEC 60664-5:2007, IDT)
This Malaysian Standard specifies the dimensioning of clearances and creepage distances for spacings equal to or less than 2 mm for printed wiring board and equivalent constructions, where the clearance and the creepage distance are identical and are along the surface of solid insulation. The dimensioning in this standard is more precise than that provided by IEC 60664-1. However, if the precision provided by this standard is not required, IEC 60664-1 may be applied instead.
This standard is based on the following criteria for dimensioning: - minimum clearances independent of the micro-environment; - minimum creepage distances for pollution degrees 1, 2 and 3 to avoid failure due to tracking; - minimum creepage distances to avoid flashover across the insulating surface
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14/05/2019
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NSC 05 - Generation, Transmission & Distribution of Energy
